Sputtering System

Sputtering System

Sputtering System is a kind of thin film depositing apparatus in which energetic ions hit on target materials to sputter out the material atoms, and the atoms reach the substrate and are deposited on. An advantage of this depositing method is that it can be applied to high melting point materials deposition at relatively low temperature, metal alloys, metal oxide dielectrics, insulants and others.

Tokyo Institute of Technology, National Institute for Materials Science, National Institute of Materials Science, and National Institute of Advanced Industrial Science and Technology

Magnetron Sputtering Deposition System

	４"Magnetron Sputtering Source

This System is an ultra-high vacuum planar magnetron sputtering system using DC magnetron sputter guns. It is equipped with a rotational substrate holder with cooling function, which enables uniform deposition without heat damage. At most three targets can be inserted for multi-layer deposition. Its design is based on human-factors engineering; for example the good usability of sample / tip transporting and the internal locking for safety use.

Four Source Magnetron Sputtering Deposition System

This system is a planer magnetron sputtering system equipped with four magnetron sputtering sources. It can be operated at ultra-high vacuum due to the uniquely designed load-lock mechanism of Kitano. The rotary substrate stage gives good uniformity in thickness and good material quality, and the sample cooling mechanism prevents the samples from the heat damage. At most four sputtering sources for multi-layer deposition are available. This system is designed as a multi chamber system with scalability and can be easily connected to your present apparatus in use.