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OLED Production Systems for R&D

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OLED Production Systems for R&D

Deposition system for developing organic materials
KVD-OLED Evo.2

Intended usage
  • Developing organic EL materials
  • Developing high-polymer materials
  • Developing phosphorescent materials
  • Developing organic thin-film solar cells
  • Developing organic electronics devices, etc.
External views
Appearance
Appearance
CAD data (under construction)
Overall views
Overall views
CAD data (under construction)
Estimate
KVD-OLED Evo.2
* Our company can design and provide the system according to the customers' specifications. For details, click here to contact us.
Reference

Line-up of film coating systems for developing organic materials (PDF : Japanese)
http://www.kitano-seiki.co.jp/product/organic/KVD.pdf

Features
  • The same room can be used to form films from organic or metal materials.
  • Deposition by co-evaporation of organic and metal materials is enabled.
  • Deposition by co-evaporation of organic materials is enabled (Max.: 4 elements).
  • The system is equipped with a water-cooling jacket for preventing a mixture of organic and metal materials.
  • In the deposition room, substrates and masks can be replaced in a vacuum environment.
  • The gap between the substrate and the mask is minimized.
  • The substrate rotation mechanism achieves an in-plane film thickness distribution of ±5%.
  • The organic deposition cell excels in directional characteristics and reduces material contamination in the deposition room.
  • A special surface coating is applied over the inner surface of each processing room, which shortens the time to achieve the target vacuum environment pressure.
  • The system can be connected to a glove box system.
  • PLC control enables automated transfer and exhaustion.
  • In the standard state, the load lock room can accommodate a total of five substrates and mask holders.
  • A substrate heating room is incorporated for pre-processing.
Specifications
System configuration
No. of film Deposition rooms 1: Used for both organic and metal materials
Deposition sources 8 for organic and 2 for metal materials.
Substrate size (inch) 2
Film thickness resolution
(Å/s)
0.0057 Å/s (with CYGNUS made by INFICON)
No. of film thickness sensors 4: Used for both organic and metal materials
Cooling system for
film thickness sensors
Water-cooling (The chiller controls temperature at an accuracy of 0.01°C.)
Deposition by co-evaporation
of organic materials
Enabled (A unique control method allows a dope mixture ratio of 0.1 to 30wt% when host materials are deposited at 1Å/s.)
In-plane distribution (%) In a 50mm diameter area, ±3% for organic films, and ±5% for metal films
Preprocessing room 1 (for heating substrates)
No. of racks
in the load lock room
5
Ultimate
pressure (Pa)
Deposition
room
10-6 class
Load lock
room
10
Vacuum
evacuation
system
Deposition
room
Cryo pump
Preprocessing
room
Cryo pump
Load lock
room
Dry pump
  Dry pump (roughing vacuum pump)
Input power source 3φ 200V 130A
Automated exhaustion
Enabled (optionally)
Automated vent
Automated transfer
Automated vapor deposition
Substrate heating
during vapor deposition
Enabled (optionally)
Glove box connection Enabled (optionally)
Space required
for installing
only the system
3800×1200
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Deposition system for developing organic materials
KVD-OLED Evo.3

Intended usage
  • Developing organic EL materials
  • Developing high-polymer materials
  • Developing phosphorescent materials
  • Developing organic thin-film solar cells
  • Developing organic electronics devices, etc.
External views
Appearance
Appearance
CAD data (under construction)
Overall views
Overall views
CAD data (under construction)
Estimate
KVD-OLED Evo.3
* Our company can design and provide the system according to the customers' specifications. For details, click here to contact us.
Reference

Line-up of film coating systems for developing organic materials (PDF : Japanese)
http://www.kitano-seiki.co.jp/product/organic/KVD.pdf

Features
  • The system is equipped with a water-cooling jacket for preventing a mixture of organic and metal materials.
  • In the deposition room, substrates and masks can be replaced in a vacuum environment.
  • The gap between the substrate and the mask is minimized.
  • The substrate rotation mechanism achieves an in-plane film thickness distribution of ±5%.
  • The organic deposition cell excels in directional characteristics and reduces material contamination in the room.
  • A special surface coating is applied over the inner surface of each processing room, which shortens the time to achieve the target vacuum environment pressure.
  • The system can be connected to a glove box system.
  • In the standard state, the load lock room can accommodate a total of twelve substrates and mask holders.
  • PLC control enables automated transfer and exhaustion.
Specifications
System configuration
No. of deposition rooms 1 for organic materials, and 1 that is used for both organic and metal materials
Deposition sources 8 + 6 for organic materials and 3 elements for metal materials
Substrate size (inch) 2
Film thickness resolution
(Å/s)
0.0057 Å/s (with CYGNUS made by INFICON)
No. of film thickness sensors 4 sensors for each room
Cooling system for
film thickness sensors
Water-cooling (The chiller controls temperature at an accuracy of 0.01°C.)
Deposition by co-evaporation
of organic materials
Enabled (A unique control method allows a dope mixture ratio of 0.1 to 30wt% when host materials are evaporated at 1Å/s.)
In-plane distribution (%) In a 50mm diameter area, ±3% for organic films, and ±5% for metal films
Preprocessing room -
No. of racks
in the load lock room
4X3 (rows)
Ultimate
pressure (Pa)
Deposition
room
10-6 class
Load lock
room
10-5 class
Vacuum
evacuation
system
Deposition
room
Cryo pump
Preprocessing
room
-
Load lock
room
Turbo molecular pump
  Dry pump (roughing vacuum pump)
Input power source 3φ 200V 150A
Automated exhaustion
Enabled (optionally)
Automated vent
Automated transfer
Automated vapor deposition
Substrate heating
during vapor deposition
Enabled (optionally)
Connection with
a glove box system
Enabled (optionally)
Space required
for installing
only the system
3900X1200
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Deposition system for developing organic materials
KVD-OLED Evo. Cluster

Intended usage
  • Developing organic EL materials
  • Developing high-polymer materials
  • Developing phosphorescent materials
  • Developing organic thin-film solar cells
  • Developing organic electronics devices, etc.
External views
Appearance
Appearance
CAD data (under construction)
Overall views
Overall views
CAD data (under construction)
Estimate
KVD-OLED Evo.Cluster
* Our company can design and provide the system according to the customers' specifications. For details, click here to contact us.
Reference

Line-up of film coating systems for developing organic materials (PDF : Japanese)
http://www.kitano-seiki.co.jp/product/organic/KVD.pdf

Features
  • The 3-axis robot mechanism enables the transfer of masks and specimens.
  • The transfer room can optionally be equipped with a substrate holder vacuum sealing mechanism.
  • Deposition by co-evaporation of organic materials is enabled (Max.: 4 elements).
  • Vapor deposition of eight types of organic materials can be prepared in the same room.
  • Two organic deposition rooms are incorporated. This allows 16 organic deposition sources to be installed.
  • The system is equipped with a water-cooling jacket for preventing a mixture of organic and metal materials.
  • In the deposition room, substrates and masks can be replaced in a vacuum environment.
  • The gap between the substrate and the mask is minimized.
  • The substrate rotation mechanism achieves an in-plane film thickness distribution of ±5%.
  • The organic deposition cell excels in directional characteristics and reduces material contamination in the deposition room.
  • A special surface coating is applied over the inner surface of each processing room, which shortens the time to achieve the target vacuum environment pressure.
  • The system can be connected to a glove box system.
  • Plasma substrate cleaning is enabled in the preprocessing room.
  • In the standard state, the load lock room can accommodate a total of six substrates and mask holders.
  • PLC control enables automated transfer, exhaustion, and vapor deposition.
Specifications
System configuration
No. of film deposition rooms 2 for organic and 1 for metal materials
Deposition sources 8 X 2 for organic and 5 for metal materials
Substrate size (inch) 2
Film thickness resolution
(Å/s)
0.0057Å/s (with CYGNUS made by INFICON)
No. of film thickness sensors 8 for organic and 2 for metal materials
Cooling system
for film thickness sensors
Water-cooling (The chiller controls temperature at an accuracy of 0.01°C.)
Deposition by co-evaporation
of organic materials
Enabled (A unique control method allows a dope mixture ratio of 0.1 to 30wt% when host materials are Deposited at 1Å/s.)
In-plane distribution (%) In a 50mm diameter area, ±3% for organic films, and ±5% for metal films
Preprocessing room 1 (Plasma cleaning)
No. of racks in the load lock room 12
Ultimate
pressure (Pa)
Deposition
room
10-6 class
Load lock
room
10-5 class
Vacuum
evacuation
system
Deposition
room
Cryo pump
Preprocessing
room
Turbo molecular pump
Load lock
room
Turbo molecular pump
  Dry pump (roughing vacuum pump)
Input power source 3φ 200V 200A
Automated exhaustion Standard feature
Automated vent Standard feature
Automated transfer Standard feature
Automated vapor deposition Standard feature
Substrate heating
during vapor deposition
Enabled (optionally)
Connection with
a glove box system
Enabled (optionally)
Space required
for installing
only the system
2000X2000
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Deposition system for developing organic materials
KVD-OLED Evo.1

Intended usage
  • Developing organic EL materials
  • Developing high-polymer materials
  • Developing phosphorescent materials
  • Developing organic thin-film solar cells
  • Developing organic electronics devices, etc.
External views
KVD-OLED Evo.1
KVD-OLED Evo.1 Appearance
Appearance
CAD data (under construction)
KVD-OLED Evo.1 Overall views
Overall views
CAD data (under construction)
Estimate
KVD-OLED Evo.1
* Our company can design and provide the system according to the customers' specifications. For details, click here to contact us.
Reference

Line-up of film coating systems for developing organic materials (PDF : Japanese)
http://www.kitano-seiki.co.jp/product/organic/KVD.pdf

Features
  • The transfer mechanism allows the transfer of masks and specimens.
  • The same room can be used to form films from organic or metal materials.
  • Deposition by co-evaporation of organic and metal materials is enabled.
  • Deposition by co-evaporation of organic materials is enabled (Max.: 4 elements).
  • The system is equipped with a water-cooling jacket for preventing a mixture of organic and metal materials.
  • In the deposition room, substrates and masks can be replaced in a vacuum environment.
  • The gap between the substrate and the mask is minimized.
  • The substrate rotation mechanism achieves an in-plane film thickness distribution of ±5%.
  • The organic deposition cell excels in directional characteristics and reduces material contamination in the deposition room.
  • A special surface coating is applied over the inner surface of each processing room, which shortens the time to achieve the target vacuum environment pressure.
  • The system can be connected to a glove box system.
  • PLC control enables automated transfer and exhaustion.
  • In the standard state, the load lock room can accommodate a total of five substrates and mask holders.
Specifications
System configuration
No. of deposition rooms 1: Used for both organic and metal materials
Depositon sources 6 for organic materials and 3 for metal materials
Substrate size (inch) 2
Film thickness resolution
(Å/s)
0.0057Å/s (with CYGNUS made by INFICON)
No. of incorporated film
thickness sensors
4: Used for both organic and metal materials
Cooling system for
film thickness sensors
Water-cooling (The chiller controls temperature at an accuracy of 0.01°C.)
Deposition by co-evaporation
of organic materials
Enabled (A unique control method allows a dope mixture ratio of 0.1 to 30wt% when host materials are evaporated at 1Å s.)
In-plane distribution (%) In a 50mm diameter area, ±3% for organic films, and ±5% for metal films
Preprocessing room -
No. of racks
in the load lock room
5
Ultimate
pressure (Pa)
Deposition
room
10-6 class
Load lock
room
10
Vacuum
evacuation
system
Deposition
room
Cryo pump
Preprocessing
room
-
Load lock
room
Dry pump
  Dry pump (roughing vacuum pump)
Input power source 3φ 200V 75A
Automated exhaustion
Enabled (optionally)
Automated vent
Automated transfer
Automated vapor deposition
Substrate heating during
vapor deposition
Enabled (optionally)
Connection with
a glove box system
Enabled (optionally)
Space required
for installing
only the system
2600X1200
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